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Details

Applications of the compound 3,5-Methano-2H-cyclopenta[b]furan-3(3aH)-carboxylicacid,tetrahydro-6-[(2-methyl-1-oxo-2-propen-1-yl)oxy]-2-oxo- ( CAS No. 1279698-96-2)

Compound Overview

Chemical Name: 3,5-Methano-2H-cyclopenta[b]furan-3(3aH)-carboxylic acid, tetrahydro-6-[(2-methyl-1-oxo-2-propen-1-yl)oxy]-2-oxo-
CAS Number: 1279698-96-2
Molecular Type: Functionalized cyclopentafuran derivative
Primary Industry Applications: Semiconductor manufacturing, photoresist formulation, advanced electronic chemicals

Chemical and Physical Properties

  • Molecular Structure: This compound features a fused cyclopentafuran ring with a carboxylic acid group and an oxy-functionalized methacrylate moiety.
  • Functional Groups:
    • Methacrylate ester: Contributes to polymerization and cross-linking behavior in resist matrices.
    • Carboxylic acid: Enhances solubility in polar solvents and provides sites for further chemical modification.
    • Fused ring system: Imparts rigidity and thermal stability to resulting polymer networks.
  • Solubility: Generally soluble in organic solvents such as acetone, ethyl acetate, and propylene glycol derivatives. Limited solubility in water.
  • Thermal Stability: The tetrahydrofuran-fused ring and methacrylate ester confer moderate thermal stability, suitable for photolithographic baking processes.
  • Reactivity: The methacrylate ester undergoes free-radical polymerization under UV or thermal initiation, while the carboxylic acid may engage in acid-base or condensation reactions.

Industrial Applications

  1. Photoresist Industry
  • Acts as a monomer or cross-linking agent in the formulation of chemically amplified resists (CARs) for advanced photolithography.
  • Enhances resolution and line-edge roughness (LER) in deep ultraviolet (DUV) or extreme ultraviolet (EUV) lithography due to its rigid fused ring structure.
  • Provides reactive sites for photopolymerization, enabling precise pattern transfer on semiconductor wafers.
  1. Semiconductor Manufacturing
  • Serves as a specialty electronic chemical for wafer coating and patterning processes, supporting fine-feature device fabrication.
  • Improves adhesion and mechanical properties of polymer films applied on silicon, glass, or metal substrates.
  1. Polymer and Electronic Materials
  • Can be incorporated into cross-linkable polymers to enhance thermal and chemical resistance of coatings.
  • Functional groups allow for tailored polymer architectures, critical for next-generation semiconductor nodes.

Key Advantages in Industry

  • High thermal and chemical stability, enabling reliable processing under harsh lithographic conditions.
  • Functional versatility, with both polymerizable methacrylate and acidic carboxyl groups for precise formulation control.
  • Compatibility with advanced photolithography, making it suitable for DUV and EUV photoresists in cutting-edge semiconductor fabrication.

Handling and Safety Considerations

  • Storage: Store in a cool, dry place, away from strong oxidizers or bases.
  • Safety: Use appropriate PPE, as methacrylate derivatives can cause skin and eye irritation.
  • Environmental Considerations: Avoid release into water systems; disposal should follow local chemical waste regulations.

Conclusion

CAS No. 1279698-96-2 is a highly specialized chemical for semiconductor and photoresist applications, combining the rigidity of a cyclopentafuran ring with polymerizable methacrylate functionality. Its chemical versatility and stability make it invaluable in the development of high-resolution photoresist formulations and advanced electronic materials.

Product:1279698-96-2, Semiconductor Photoresist, Electronic Chemicals