DVS-bis-BCB or DVS-BCB, it’s chemical name is Divinylsiloxane-bisbenzocyclobutene or  1,3-Bis(2-(bicyclo[4.2.0]octa-1,3,5-trien-3-yl)vinyl)-1,1,3,3-tetramethyldisiloxane.

It is a high-performance thermosetting benzocyclobutene (BCB) monomer widely used for producing low-dielectric-constant (low-k) polymer materials in advanced electronic packaging, semiconductor interconnects, and optoelectronic devices. such as Semiconductor interlayer dielectric (ILD), Wafer-level packaging (WLP), Advanced packaging and high-frequency electronics, Optoelectronics and photonics, MEMS and sensor technologies, Advanced PCB and Copper-Clad Laminate Materials, Fan-Out Wafer-Level Packaging (FOWLP), Chip-to-Wafer and Wafer Bonding.

with increasing demand for low-loss, high-speed electronic systems, BCB-based dielectric materials continue to be investigated for next-generation packaging platforms.

BCB Monomer Quality Specifications:

Appearance: Colorless to light yellow transparent oily liquid

Purity (GC): >97%

Individual metal impurity (ICP-MS): <0.1 ppm

Water content (K.F.): <0.1%

DVS-bis-BCB polymers are valued because curing proceeds through benzocyclobutene ring opening with minimal volatile by-products, producing low-stress dielectric films.

BCB resin is widely used in semiconductor packaging, Copper-clad laminate (CCL) wafer-level packaging (WLP), redistribution layers (RDL), interposers, RF/microwave devices, photonic devices, and high-frequency substrates etc.